Low-Temperature Cure Platinum Catalyst – Fast Crosslinking for Thermal Potting & Gel Systems
Product Overview for Platinum Catalyst
This versatile low-temperature cure platinum catalyst enables efficient crosslinking even below 50°C, making it perfect for heat-sensitive components, thick potting sections, and gel systems where fast gelation and low exotherm are needed.
Product Features for Platinum Catalyst
Product Parameters for Platinum Catalyst
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Platinum content: 3500–5000 ppm
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Gel time @ 40°C: 5–15 minutes
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Max exotherm rise: < 20°C above ambient
Applications for Platinum Catalyst
Thermal potting gels for electronics
Silicone gels for medical cushioning
Low-temperature molding compounds
Encapsulation of heat-sensitive sensors
Operating Guidelines for Platinum Catalyst
Dosage: 0.1–0.7% in silicone base
Mix thoroughly, degas if needed
Cure: 40–80°C for 1–3 hours
Precautions for Platinum Catalyst
Do not exceed recommended thickness without testing
Avoid exposure to acidic or basic contaminants
Packaging & Storage for Platinum Catalyst
250 g, 1 kg, 5 kg plastic or glass containers
Store at 15–25°C
FAQ for Platinum Catalyst
What is the minimum cure temperature?
Can cure at room temperature (25°C), though 40–60°C is recommended for faster cycles.
Is it suitable for potting lithium-ion batteries?
Yes, its low exotherm and good thermal conductivity make it ideal.
Can it be used with automatic dispensing equipment?
Yes, it has stable viscosity and good flow properties.
What is the dielectric strength after cure?
Typically >20 kV/mm.
Does it adhere to PCB substrates?
Adhesion is good to most substrates, but a primer may be needed for non-silicones.
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