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Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver

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Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver

Brand Name : Hanast

Model Number : HN-5508AB

Certification : ROHS SGS

Place of Origin : Guangdong, China

MOQ : 1KG

Price : Negotiable

Payment Terms : T/T, D/A, D/P

Packaging Details : 25KG/barrel

Hardness : Shore D 80

Electrical Insulation : High

Operating Temperature : -40°C to 150°C

Flame Retardant : UL 94 V-0

Thermal Conductivity : 0.8 W/m·K

Dielectric Strength : 500 V/mil

Chemical Resistance : Excellent

Cure Time : 24 hours

Density : 1.71±0.05，g/cm3

Color : Transparent

Shrinkage : Less than 0.1%

Viscosity : 1000 cps

Appearance : Liquid

Mix Ratio : 5:1

Adhesion Strength : 500 psi

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Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver

Product description:

HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers, ignition coils, high voltage packs, aquarium equipment, anion generators, ultrasonic atomizers, and electronics and other components that require insulation, flame retardant, and temperature resistance. It has flame retardant insulation, sealing bonding, moisture-proof earthquake resistance, temperature resistance, and other main functions.

  1. Electrical Insulation: Excellent dielectric properties, ensuring reliable circuit protection.

  2. Environmental Resistance: Withstands moisture, chemicals, and thermal stress for long-term durability.

  3. Structural Integrity: Enhances mechanical strength and vibration resistance after curing.

Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver

Before curing builder Epoxy resin 5508 Curing agent 5508
pigment Black / White et al Ruburn / transparent surface
A sticky epoxy resin water r liquid specific
c gravity, g / cm3 1.4-1.5 1.05
Viscosity of 25℃ 4,500—6,000cp s 150—250cp storage
e Period (25℃) Six months x months

processabili

 mixing ratio A: B =5:1 (weight ratio)
Available for a time of 25℃ 2-3H (100g mix)
curing time 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing 2 Tensile strength of kg/cm 16-18
2 Compressive strength of kg/cm 18-22
Resistance to the voltage of kv/mm 20-22
Surface resistance ofΩ-cm

14

1.2*10
Volume resistance ofΩ-cm

15

1.1*10
contraction percentage% 0.35-0.55
Water absorption rate was 25℃ * 24H <0.03%

The hardness of SHORE A 85-95

distortion

temperature ℃

 130-150
low temperature resistant ℃

-30

storage and transportation

1. Store in a cool and dry place with a storage period of 6 months (25℃).

2. Products beyond the storage period should be confirmed whether there are any abnormalities before being used.

3. Parts A and B of the colloid must be sealed and preserved, with careful leakage during transportation!

4. These kinds of products are non-dangerous goods and can be transported as general chemicals.

Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver

Product application:

Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver

Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver

Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver

Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver

Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver

Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver


Product Tags:

potting epoxy resin Raw Material

      

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